CH226 V3 is a full-width compute node providing powerful computing capabilities and large storage capacity. It uses the new-generation Intel® Grantley processors and provides up to six 3.5-inch and two 2.5-inch hard disks. The CH226 V3 support hot swap of hard disks.
CH226 V3s are installed in a E9000 chassis and managed by the MM910 management module in a centralized manner.
The CH226 V3 applies to massive data analysis and processing applications that require both large storage capacity and high computing performance, such as videos, search engines, and biological sciences.
Figure 1 CH226 V3 components
|1||3.5-inch hard disk||2||2.5-inch hard disk|
|3||RAID controller card||4||(Optional) Supercapacitor|
|5||DIMM||6||(Optional) USB 3.0|
|7||(Optional) SATADOM||8||Mezz card|
|9||(Optional) MicroSD card||10||Heat sink|
|11||CPU||12||(Optional) Trusted platform
|13||Mainboard||14||PCIe card tray|
|15||(Optional) PCIe card||–||–|
The components of the CH226 V3.
|A maximum of six 3.5-inch HDDs are supported.
Each hard disk is hot-swappable and can be
independently installed and removed.
|A maximum of two 2.5-inch HDDs/SSDs are
supported. Each hard disk is hot-swappable and
can be independently installed and removed.
|A RAID controller card connects to hard disks to
expand the storage capacity and improve data
security for a compute node. A RAID controller
card provides eight SAS/SATA ports for
connecting to six 3.5-inch hard disks and two
2.5-inch hard disks.
|The mainboard supports four types of RAID
controller cards: LSISAS2208, LSISAS2308,
LSISAS3008, and LSISAS3108.
|LSISAS2208: supports RAID 0, 1, 5, 6, 10, 50, and 60.|
|LSISAS2308: supports RAID 0, 1, 1E, and 10.|
|LSISAS3008: supports RAID 0, 1, 1E, and 10.|
|LSISAS3108: supports RAID 0, 1, 5, 6, 10, 50, and 60.|
|When the LSISAS2208 or LSISAS3108 controller
card is installed, you can install a supercapacitor
to provide power-off protection at power failures.
|5||DIMM||A mainboard provides 24 slots for installing
DIMMs (12 DIMMs for each processor).
|Maximum memory speed: 2400 MHz|
|Memory protection: ECC, memory mirroring,
and memory sparing
|DIMM type: registered DIMM (RDIMM) and
load-reduced DIMM (LRDIMM). A compute
node does not allow mixed use of DIMM types
(RDIMMs and LRDIMMs) or DIMM specifications (such as the capacity, bit width,
number of ranks, and height). Therefore, all
DIMMs on a compute node must use the same
BOM number. For details about the BOM
numbers, see Huawei Server Compatibility Checker.
|RDIMMs: up to 768 GB for 24 x 32 GB
RDIMMs and two CPUs
|LRDIMMs: up to 768 GB for 24 x 32 GB
LRDIMMs and two CPUs
|The mainboard provides a built-in USB port for
connecting to a USB 3.0 device within the
dimensions of 31.75 mm * 12.00 mm * 4.50 mm.
|The serial ATA disk on module (SATADOM) is a
SATA SSD or SATA DOM electrical hard disk. It is
a quick memory storage media unit that features
energy efficiency and high stability.It can be used
only as a boot device and cannot be used for
|For details about STATADOM application
scenarios,see the STATADOM Technical White Paper.
|8||Mezz card||A mainboard provides two mezzanine card
connectors. The mezzanine cards connect to
the backplane and map to the switch modules or
pass through modules.
|Mezz1 is above Mezz2.|
|Socket CPU1 provides PCIe x16 bandwidth for
connecting to Mezz1, and socket CPU2
provides PCIe x16 bandwidth for connecting
|Mezz1 is connected to the slots 2X and 3X at
the rear of the E9000 chassis.
|Mezz2 is connected to the slots 1E and 4E at
the rear of the E9000 chassis.
|The mainboard provides two microSD card slots.
Each slot supports a microSD card with a
maximum capacity of 32 GB, and the microSD
card can be used as the boot medium for a
compute node. If two microSD cards are
installed, they are configured as RAID 1.
|10||Heat sink||The heat sink is used to cool CPUs. Each CPU
is configured with one heat sink.
|11||CPU||The mainboard supports one or two CPUs.|
|The following CPUs are supported:|
|Intel Xeon E5-2600 v3 (Haswell-EP) CPUs
of 55 W, 65 W, 75 W, 85 W, 90 W, 105 W,
120 W, 135 W, and 145 W, with a
maximum of 18 cores per CPU.
|Intel Xeon E5-2600 v4 (Broadwell-EP)
CPUs of 55 W, 65 W, 75 W, 85 W, 90 W,
105 W, 120 W, 135 W, and 145 W, with a
maximum of 22 cores per CPU.
|Each processor integrates a memory
controller for supporting four DDR4 memory
channels. Each channel supports three DDR4
DIMMs of 1600/1866/2133/2400 MHz.
|Each processor integrates a PCIe controller
for supporting PCIe 3.0 and providing 40 lanes.
|Every two processors are interconnected
through two QuickPath Interconnect (QPI)
links, with each link delivering up to 9.6 GT/s.
|Maximum dominant frequency: 3.5 GHz|
|12||(Optional)TPM||Trusted Platform Module (TPM) 1.2 and TPM 2.0
are supported. The TPM is a security solution that
complies with the Trusted Computing Group
(TCG) standards. It enhances platform security
by preventing viruses or unauthorized operations.
|13||Mainboard||The mainboard holds the CPUs, DIMMs, hard disk
interface modules, power control module, iBMC
(integrated baseboard management controller),
logic module, chipset and display adapter.
|The server chipset is the Platform Controller Hub
(PCH) using the Intel C610 chip.
|The display adapter is integrated in the iBMC
chipset. It provides a 32 MB display memory. The
maximum resolution is 1920 x1200 at 60 Hz with
16 M colors.
|14||PCIe card tray||Located between the memory and hard disk tray,
the PCIe card tray holds a riser card that provides
one PCIe 3.0 x8 slot.
|A full-height half-length or half-height half-length
standard PCIe card, for example, a PCIe SSD or
PCIe RAID card, can be configured.
layout of the CH226 V3 mainboard.
|1||BIOS battery||2||Power connector of the
3.5-inch hard disk backplane
|3||PCIe riser card connector||4||TPM connector|
|5||Mini SAS HD cable A
|6||Mini SAS HD cable B
|7||3.5-inch hard disk backplane
|8||2.5-inch hard disk
|9||Indicator card connector||10||PCH|
|11||RAID controller card
|12||USB 3.0 port|
|13||SATADOM connector 2||14||SATADOM connector 1|
|15||Mezz card connector 1||16||Mezz card connector 2|
|17||Mezz card tray||18||Positioning pin|
|19||Backplane signal connector||20||MicroSD card 1 slot|
|21||MicroSD card 2 slot||22||Backplane power connector|
|23||Positioning pin||24||Power connector|
HUAWEI E9000 Blade Server Compute nodes configurations as below :
03054855 IT1DSRCA06 Romley EP computes the node-CH121
03055640 IT11SRCC02 The Romley EP computes the node-CH140
03054861 IT1DGRUA03 4 * X8 PCIe Resource Extension The Romley EP compute node, -CH220
03054862 IT1DGRUA04 2 * X16 PCIe Resource Extension The Romley EP compute node, -CH221
03054852 IT1DSESA02 15 * 2.5 “HDD storage expansion Romley EP compute node -CH222
03030QMF IT1DSRCD03 Romley, 4P, 48DIMM Compute the node -CH240
03054986 IT11SBCA03 Boxboro EX RAID 0/1 compute node -CH242
03055236 IT11SBCA05 Boxboro EX RAID 0/1/10/5/50/6/60 1GB Cache Compute node -CH242
03030SAB IT11SBCB01 Brickland EX compute node CH242 V3 8HDD
03030SAD IT11SBCB02 Brickland EX compute node CH242 V3 4HDD
Hard disk Built-In – Handle options for E9000 server:
02310LBB BC1MSRSCR803 Universal Hard Disk – 500GB-SATA-7200rpm-2.5 “-64M- Hot Swap – Built-In – Handle
02310LAY BC1MSRSCR804 Universal Hard Disk – 1000GB-SATA-7200rpm-2.5 “-64M-Hot Swap-Built-In-Handle
02310LHE BC1MSRSCR807 Universal hard disk -146GB-SAS-15000rpm-2.5 “-64MB-Hot-swappable-built-in-handle
02310KPR N0SASHD06 Universal hard disk -300GB-SAS-10000rpm-2.5 “-16M-hot swap – built-in – handle
02310MMV BC1MSRSCR821 General-purpose hard disk-300GB-SAS 6Gb / s-15000rpm-2.5 “-64M-Hot Swap-Built-in-handle
02310KPU N0SASHD07 General-purpose hard disk -600GB-SAS 6.0Gb / s-10000rpm-2.5 “-16MB and above – Hot Swap – Built-in – handle
02310LYS BC1MSHDSAS03 Universal Hard Drive – 900GB-SAS 6.0Gb / s-10000rpm-2.5 “-64MB and above – Hot Swap – Built-in – Handle
02310UGC BC1HDD37 General Purpose Hard Drives -1200GB-SAS 6Gb / s-10000rpm-2.5inch-64MB-Hot Swap-Built-in -2.5-Inch Handle
02310MLB BC1M0NLSAS03 General Purpose Hard Drives – 1000GB-NL SAS 6Gb / s-7200rpm-2.5 “-64M- Hot Swap – Internal – Handle
02310KSX NSSDST161 Solid State Drive – 160GB-SATA-2.5 “- NAND Flash – Consumer, 1200000 hours – Hot Swap – Built-In – Handle
02310SLK BC1SSD06 Solid State Drive – 200GB-SATA 6Gb / s-2.5 inch-eMLC-End-to-End Datapath Protection-Only for server-Operating Temperature: 0 ~ 70-2 Million hrs-2.5 inch
02310MMT BC1HDD05 Solid-state hard drive – 240GB-SATA III-2.5 “-MLC-consumer, U8 one machine dedicated -1,200,000
02310LTB BC1MSRSCR808 Solid State Drive – 300GB-SATA-2.5 “- NAND Flash – Consumer, 1200000 hours – Hot Swap – Built-In – Handle
02310SLL BC1SSD07 Solid-State Drive -400GB-SATA 6Gb / s-2.5 inch-eMLC-End-to-End Datapath Protection -For Server Products-Operating Temperature 0 to 70 degrees Celsius -2 Million hrs-2.5 inches
02310SLH BC1SSD04 Solid State Drives – 480 GB-SATA 6Gb / s-2.5 inch-MLC NAND flash – Server-only use -480GB capacity points -2.5 inch handle
02310MMS BC1MSRSCR820 Solid State Drive – 600GB-SATA II-2.5 “-MLC
02311BFM BC1SSD22 Solid State Drives-800GB-SATA 6Gb / s-2.5 inch-eMLC-2 Million hrs-2.5inch
02310YHK BC2SSD800G01 Solid State Drive-800GB-SATA 6Gb / s-2.5 inch-NAND flash-1,200,000-2.5-inch handle