Huawei GPON MA5800-X2 OLT Physical Specifications

This text provides the dimensions, weight, power supply specifications, and power consumption of the MA5800-X2 service subrack.

Dimensions and weight of the MA5800-X2 GPON OLT:

Specification Value
Dimensions (H x W x D, excluding mounting ears) 88.1 mm x 442.0 mm x 268.7 mm
Dimensions (H x W x D, including mounting ears of IEC standard) 88.1 mm x 482.6 mm x 268.7 mm
Dimensions (H x W x D, including mounting ears of ETSI standard) 88.1 mm x 535.0 mm x 268.7 mm
Maximum fully-loaded weight (including mounting ears of IEC standard) 9.4 kg

Power Supply Parameters of the MA5800-X2 GPON OLT:

Specification Value
Power supply mode DC (dual power for backup)/AC power + battery
Rated voltage
  • DC power: -48 V/-60 V
  • AC power: 110 V/220 V
Working voltage range
  • DC power: -38.4 V to -72 V
  • AC power: 100 V to 240 V
Maximum input current
  • DC power: 20 A
  • AC power: 8 A

Power consumption of the MA5800-X2 service subrack (Unit: W)

Typical Configuration Static power consumption Maximum power consumption Typical power consumption Board configuration
GPON 164.5 299.5 232.0 H901MPSC*2+H901GPHF*2+H901PISA+H901FMSA

Slot Configuration of MA5800-X2 FTTH OLT:

An MA5800-X2 service subrack provides 5 slots, including 2 slots for control boards, 1slot for power board, and 2 slots for service boards. H901BPSB is the backplane supported by the MA5800-X2.

Configuration of boards in the MA5800-X2:

lists the configuration of boards in the MA5800-X2.

Boards in the MA5800-X2:

Slot Type Slot Supported Board Remarks
Control board slot 3,4 Control board The device is configured with both active and standby control boards of the same type in 2 slots.
Power board slot 0 Power board
Service board slot 1,2
  • Uplink interface board
  • Service board
Mixed configuration of service boards is supported.
Heat Dissipation:

This topic describes the ventilation of the MA5800-X2 service subrack.

The MA5800-X2 service subrack has a fan tray at the right side to exhaust hot air for heat dissipation.

The airflow is as follows: The cool air enters the MA5800-X2 service subrack at the left side, and is blown towards the right side by the fans, and finally, exits at the right side of the MA5800-X2 service subrack.Figure 6-2 shows the heat dissipation of the MA5800-X2 service subrack.

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Huawei MA5608T OLT

Appearance

The MA5608T is 2 U high.

Figure 1 Appearance of the MA5608T chassis(xDSL)

ma5608t_appearance_xdsl

Figure 2 Appearance of the MA5608T chassis(GPON)

ma5608t_appearance_gpon

Specification

This topic provides the dimensions, weight, and power consumption of the MA5608T chassis.

Dimensions and weight of the MA5608T
Item Specification
Dimensions (W x D x H, excluding mounting brackets) 442mm×244.5mm×88.1mm
Dimensions (W x D x H, including mounting brackets of IEC standard) 482.6mm×244.5mm×88.1mm
Dimensions (W x D x H, including mounting brackets of ETSI standard)

NOTE:

ETSI standard dimension is to add the ETSI mounting bracket on the IEC mounting bracket.

535mm×244.5mm×88.1mm
Weight (empty chassis) 3.55kg
Power parameters of the MA5608T
Parameter Specification
Power supply mode DC (dual power for backup) or AC power + battery
Rated voltage DC power supply: -48 V / -60 V

AC power supply: 110 V / 220 V

Working voltage range DC power supply: -38.4 V to -72 V

AC power supply: 100 V to 240 V

Maximum input current DC power supply: 10 A

AC power supply: 6 A

Power consumption of the MA5608T chassis (Unit: W)
Typical Configuration Static Power Consumption Maximum Power Consumption Typical Power Consumption Board Configuration
ADSL2+ 78.5 225.5 152 H801MCUD*2+H801MPWC+H831FCBB+H805ADPD*2
VDSL2 104.5 257.5 181 H801MCUD*2+H801MPWC+H831FCBB+H80BVDPM(17a)*2
POTS 86.5 155.5 121 H801MCUD*2+H801MPWC+H831FCBB+H808ASPB*2
P2P 194.5 293.5 244 H801MCUD*2+H801MPWC+H831FCBB+H802OPGD*2
GPON (H805GPBD) 140.5 191.5 166 H801MCUD*2+H801MPWC+H831FCBB+H805GPBD*2
GPON (H806GPBH) 118.5 185.5 152 H801MCUD*2+H801MPWC+H831FCBB+H806GPBH*2
GPON (H805GPFD) 106.5 193.5 150  

 

Configuration

This topic provides the configuration of the boards in the MA5608T chassis, and lists the type of the boards.

H801MABR is the backplane supported by the MA5608T. When the MA5608T is configured in a cabinet, the lower cable manager must be configured.

Slot Type Slot Supported Board Remarks
Control board slot 2, 3 Control board Two slots must be configured with the same control board. You are advised to configure 2 control boards working in active/standby mode.
Power board slot 4 H801MPWC, H801MPWD power board
4, 5 H801MPWE power board
Service board slot 0, 1

Service board

  • SPU board
  • Ethernet service access board
  • TDM service processing board
  • GPON service board
  • 10G GPON service board
  • P2P interface board
  • ATM interface board
  • Combo board
  • Voice board
  • ADSL2+ service board
  • VDSL2 service board
  • SHDSL service board

MA5608T Fan Tray

A fan tray functions heat dissipation, monitoring, and fan speed adjustment, which ensures that the device works at a stable temperature.

Appearance

Two fans are configured in the fan tray of the MA5608T.

ma5608t_fan

Specification
Item Specification
Dimensions (W x D x H) 29mm×220mm×85.5mm
Weight 0.5kg
Power consumption (including FCBB board)
  • Static: 4 W
  • Maximum: 39 W
Function

The functions of the fan tray are as follows:

  • Heat dissipationThe fan tray is at the left of the service subrack and blows air for heat dissipation of the service subrack. The cool air flows to the subrack from the left of the subrack and then is exhausted from the right of the subrack after passing the boards.
  • MonitoringThe fan tray is configured with a fan monitoring board. The fan monitoring board transmits speed adjustment signals to the fan tray, collects the rotating speed signals of the fans, and reports the rotating speed signals to the control board.
  • Speed adjustmentThe rotating speed of the fans can be adjusted according to the detected temperature automatically or be adjusted by software manually.
ESD Jack

The ESD jack of the MA5608T chassis is on the middle of the fan tray, which is used to connect the ESD wrist strap to prevent device damage caused by electrostatic discharge.

The position of the MA5608T chassis ESD jack, as shown

Position of the MA5608T chassis ESD jack

ma5608t_gpon_esd

Grounding

Ground the chassis shell securely so that the influence electricity, leakage electricity can flow to the ground, improving the protection against electromagnetic interference.

Use a ground cable to connect the ground point of the chassis shell to the ground bar of the telecommunications room or to the ground directly. It is recommended that the grounding resistance of the telecommunications room should be less than 10 ohms. Refer to the local standards to ground the chassis.

The ground point of the chassis shell is on the left of the chassis, and there is a ground point on the front of the left mounting bracket as shown

Grounding of the MA5608T chassis

ma5608t_gpon_grouding

Power Distribution Principle

The MA5608T chassis adopts AC and DC power supply. This topic describes the power distribution principle of the MA5608T chassis.

ma5608t_powerprinciple

The MPWC power interface board leads two -48 V input to the backplane, and then the backplane supplies power to each board.

The MPWC boards supports two -48 V DC input. If one input is off, the other supplies power to the chassis can guarantee normal running of the system.

The MPWD power interface board supports the AC input. After AC/DC conversion, the power is supplied to the system backplane at -48 V DC.

Two MPWE boards can be configured for dual-system hot backup. Each MPWC board supports one -48 V DC input. If one MPWE board is off, the other supplies power to the chassis can guarantee normal running of the system.

Heat Dissipation

This topic describes the ventilation of the MA5608T chassis.

The MA5608T chassis has a fan tray at the left to blow air for heat dissipation.

The airflow for the MA5608T chassis is as follows: The cool air flows to the chassis through the left side, and then the fans blow the air to the right side of the chassis through the boards. Finally, the air exits through the right side of the chassis

Ventilation of the MA5608T chassis

ma5608t_chassis_airflow_gpon

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